Ed Prack is MASIP. He is a skilled technical innovator and integrator spanning research through optimized manufacturing through the integration of knowledge of materials, processes and drivers for reliability and cost.  He holds a BS and PhD in Chemistry with experience in analytical methods, material science and reliability.  Ed is  an expert in polymer dielectrics and material formulation/process to optimize adhesion. He has applied this  experience to R&D, technology transfer, supplier development, reliability guidelines and road mapping for materials and processes for strategic technologies.

Ed received a BS in Chemistry from St John’s University (Collegeville, MN) and PhD in Analytical Chemistry from  Texas A&M University. 

5 years  at Celanese running a corporate surface analysis lab as well as manage the elemental analysis lab. At Celanese he supported many leading edge technology R&D programs including tire, textile and ceramic fibers and engineering resins including LCP, membranes, NLO (nonlinear optics) and ceramic sensors.

16 years at Motorola where he build and run a state of the art analytical facility that supported the corporate manufacturing center, resulting in implementation of new corporate capabilities and new method development that supported divisions ranging from raw materials through satellites including semiconductors, ceramics, automotive/consumer electronics, cell phone/2 way radios, and military electronics. He subsequently moved to the semiconductor product sector where he became an interface/adhesion expert with responsibilities ranging from materials analysis in reliability group, managing packaging prototyping line, new process/technology development (including electroless Ni/Au  bondpad cleaning/metrology, one of  originators of RCP fan out technology) and unique materials development and implementation ( implemented the first  two PSPI  and  rationalized PSB materials in SPS).

12 years at Intel starting as an adhesion technologist supporting IC packaging in MTO (Materials Technology Operation) and subsequently ATTD (Advanced Technology & Test Development) which included key problem solving and technology/IP development for IC packaging including FAB issues that impacted package performance. 

MASIP LLC supports material suppliers, equipment suppliers and small companies in the development of new products and applications with an emphasis in IC packaging. Ed holds 32 US patents and has published in  a wide array of technical areas.​​​