Failure/Material Analysis and Analytical Method Development for Lab and Production Metrology
• Managed and designed analytical labs (focused on surface and elemental 

  analysis)
• Developed new analytical methods and methodologies

Package Prototyping and Characterization
• Managed IC packaging prototyping/characterization line/lab
• Defined and implement collaborative approach to virtual line generation

  of parts

Plastic Packaging Material/Process Development Optimization
•New class flux material (patent application)                                                  

• Optimized PTIM material (patent)
• Temporary bonding solutions (patent applications)                                    

• Laser processing applied to IC packaging (patent application)
• Additive manufactions concepts for IC packaging (patent application)

Holistic IC Package Optimization
•Moisture modeling for plastic packages (published paper)
• Adhesion optimization strategies for IC packages

         • UBM and bumping (external presentations)
         • FC-PBGA packages (external presentations)
         • WB plastic packages (published paper)

Internationally Known Expert in Passivation Stress Buffer Materials
• Set criteria for high reliability PSB materials and implemented 2 PSPSI  

  materials
• Rationalization strategy for PSB use

Flip Chip Packaging and Bumping
• Material and interface expert for FC-PBGA packaging
• Material selection and problem solving (experience with all 3 major    

  bumping processes)

• Including UBM and passivation metallurgies

Fan-in and Fan-out Package Development
• Managed international fan-in packaging effort
• Founding member of RCP team and on initial 3 patents