Wide Ranging Experiences in Organic Materials
• Thermosets, thermoplastics including fibers, membranes,   dielectric materials (films and liquid)
• Demonstrated thermoplastic encapsulation for IC  

  packages
• Defined and implemented first two high reliability PSPI
• Define new class of flux materials (NRF-no residue flux) 

  (patent application filed)
• Optimized polymer thermal interface material formulation   (patent filed)

Experience With Ceramic Materials Including Sensors, Fibers (carbon and SiCN), Powders and Parts
• Piezo ceramics, quartz and glass based sensors
• Non-oxide ceramic fibers such as carbon and SiCN, CNT 

  and graphene
• Ceramic packages and powders for thermal performance

Experience with Metals Including Conductor Materials and Housing/structural Parts (for electronics)
• Leadframe, stiffener and lid materials
• Solder (paste & plated), conductors (sputter & plated)

Material Interaction

• Defined and published drivers and guidelines for robust 

  plastic IC packages (published work)
• Materials selection consultant for RFID/smartcard initial 

  development/production
• Define, modeled and published on the impact of moisture 

  on plastic package reliability (published work)
• Tailored material adhesion for WSS (wafer support system) 

  applications (published work and patent applications)​