Degree in analytical chemistry  

Responsible for surface analysis, elemental analysis and high temperature thermal analysis lab for major chemical company corporate R&D site. 

Founder and co-chair of cross functional materials and analysis forums  

Deigned/built/ran corporate surface/interface analysis lab for major electronics company

• Purchased third ESEM which included unique 

  programmable insitu thermal and atmospheric capability

    - Developed ESEM methods for the study of solder  

      wetting and the effect of atmosphere on reflow  

      (published work)

• Purchased one of the early imaging ESCA systems       

    - Developed unique analytical capabilities            

      - DEA for particle agglomeration determination for  

         various applications (published paper)   

Managed chemical analysis/physical analysis/IC package prototype line

• SERA for Cu oxide thickness for various applications   

  (published paper)  

Applied knowledge to FAB and IC packaging problems/R&D

• Enabled HF initialtive through halogen detection 

  methodologies and aqueous cleaner monitoring for HF 

  flux/paste 

• SERA for substrate and TCB proces 

  monitoring/optimization 

• DEA for agglomeration monitoring for filled material 

  stabilit