SURFACES and INTERFACES (Adhesion Technology)

DEFINED AND PUBLISHED DRIVERS AND GUIDELINES FOR ROBUST IC PACKAGE INTERFACES  

Tailored material adhesion for WSS (Wafer Support System) applications 

Defined, modeled and published on the impact of moisture on plastic package interfaces/reliability 

ESEM methods for the study of solder wetting (effect of atmosphere on reflow)  

Solved UBM adhesion problem (which has been incorporated into all subsequent products)