MASIP LLC

MASIP LLCMASIP LLCMASIP LLC
  • Home
  • Who We Are
  • Mission Statement
  • What is MASIP
    • What is MASIP
    • Materials
    • Analysis
    • Surfaces and Interfaces
    • Processes
  • Services
  • Expertise
  • Key Accomplishments
  • Contact Us
  • More
    • Home
    • Who We Are
    • Mission Statement
    • What is MASIP
      • What is MASIP
      • Materials
      • Analysis
      • Surfaces and Interfaces
      • Processes
    • Services
    • Expertise
    • Key Accomplishments
    • Contact Us

MASIP LLC

MASIP LLCMASIP LLCMASIP LLC
  • Home
  • Who We Are
  • Mission Statement
  • What is MASIP
    • What is MASIP
    • Materials
    • Analysis
    • Surfaces and Interfaces
    • Processes
  • Services
  • Expertise
  • Key Accomplishments
  • Contact Us

Failure/Material Analysis

Surface and elemental analysis  

                  Failure root cause and mechanism definition                                  

 

Material Selection  

Dielectric materials  

Plated bump processing   

UBM materials

Flux and PTIM materials


IC Package Development and Optimization 

Wirebonded leadframe and substrate packages 

Flip chip packages 

SiP and fan-in/out packages


Analytical Method Development

Lab and production metrology


Adhesion Tailoring

Temporary bonding

Package interfaces for MSL1 and  automotive requirements

Expertise and skills in these areas gained over 30 years from experience in chemical,  diversified industrial and semiconductor industries can be applied in a wide range industries and  research. Have experience in/with  material suppliers,  equipment suppliers and end users which leads  to an understanding of issues form a wide  variety of viewpoints. Have experience with material,  component, system and end products which lends itself to a  holistic approach. Have unique  experience in both FAB and IC packaging resulting in holistic approach to backend of FAB and  packaging technologies.

MASIP LLC

ed@masipllc.com

512-789-8791

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