Failure/Material Analysis
Surface and elemental analysis
Failure root cause and mechanism definition
Material Selection
Dielectric materials
Plated bump processing
UBM materials
Flux and PTIM materials
IC Package Development and Optimization
Wirebonded leadframe and substrate packages
Flip chip packages
SiP and fan-in/out packages
Analytical Method Development
Lab and production metrology
Adhesion Tailoring
Temporary bonding
Package interfaces for MSL1 and automotive requirements
Expertise and skills in these areas gained over 30 years from experience in chemical, diversified industrial and semiconductor industries can be applied in a wide range industries and research. Have experience in/with material suppliers, equipment suppliers and end users which leads to an understanding of issues form a wide variety of viewpoints. Have experience with material, component, system and end products which lends itself to a holistic approach. Have unique experience in both FAB and IC packaging resulting in holistic approach to backend of FAB and packaging technologies.
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